Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Industry News | 2003-07-09 09:11:37.0
Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
ATTENDANT WET CHEMICAL PROCESSES) Hole wall preparatio
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body
Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Componnent_preforming_cutting/950.html
: Auto insertion machine feeder, :2021-08-22 ASCEN Through hole component insertion machine feeder is a auto insertion machine stick tube feeder,odd-form component tube feeder developed for the customer required and that is not a standard machine