Industry Directory | Manufacturer
Aetina provides industrial/embedded NVIDIA, AMD and S3 GPU (graphics processing unit) solutions for Industrial Automation, Digital Signage, Defense and Aerospace and Medical, Security and Measurement.
New system delivers high technology in cost effective platform. Nordson DAGE, the only X-ray company whose focus is on X-ray electronics inspection, offers the Nordson DAGE XD7500VR Jade FP X-ray inspection system that uses the latest technology fla
BotFactory Squink is a Desktop Electronics Printer, capable of creating PCBs in less than an hour for the fraction of the cost - only $2999 for the base unit! There are three toolheads, a heatbed and an onboard computer to handle trace printing, sold
Electronics Forum | Wed Sep 23 12:08:21 EDT 2009 | davef
larob57 Mike is not being a SA. The GPU in the XBox is packaged as a BGA [ball grid array].
Electronics Forum | Thu Sep 17 14:03:40 EDT 2009 | mikesewell
Take a look at http://www.circuitmedic.com/guides/9-0.shtml FWIW
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2014-05-26 06:06:08.0
MXM, VPX, XMC and Multi-Display Graphics Cards to Be Displayed
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic
The new Jade FP is launched into an aggressive market sector where both value and performance must be met, an area in which Nordson DAGE already has a market-leading reputation. "Performance Beyond Expectations" is this exciting new system's slogan
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
flex pcb reflow flux reflow furnace reflow gpu reflow joints reflow led reflow medical reflow nitrogen reflow oven reflow oven pcb reflow oven profile reflow oven smt reflow oven soldering reflow ovens
