Upgrade to Convection with our Cast-In heater packages to maximize thoughput, and minimize thermal gradients.
The Fritsch Convection Reflow Soldering System uses recirculated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat
Electronics Forum | Sun Mar 08 06:07:18 EST 1998 | Rob F
I am looking for information on the electrical performance affects of voltage gradients in PCBs, and links or information on trends in Surface Mount Technology.
Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 4145A The 4145A Semiconductor Parameter Analyzer performs high speed DC characterization of semiconductor devices and materials automatically, saving you time and money. It has four programmable stimulus/measurement units capable
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 4145A The 4145A Semiconductor Parameter Analyzer performs high speed DC characterization of semiconductor devices and materials automatically, saving you time and money. It has four programmable stimulus/measurement units capable
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2012-08-09 18:20:49.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.
Technical Library | 2013-06-13 15:31:24.0
Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry...
Electronic Packaging Laboratory, State University of New York
Technical Library | 2021-11-03 16:36:36.0
Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors. The detailed influence of the variety of optical parameters on the soldering process has been analyzed by using the finite element method. And the modulation of the optical parameters on reflow soldering parameters also has been demonstrated. In our experiment, one HR mirror and one-mirror with transmissivity of 10% have been used to create a gradient energy band with an incident laser power of 50W. In summary, both the simulations and the experiments show that the typical reflow soldering profile has been acquired by the optical system. The high quality joints on both the front and rear surface of the capacitor can be acquired by just one surface radiation of the optical system.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-component-tombstone-on-flex-circuit
. If this helps, the laminate is flex kapton. Answer: Some of the reasons for tombstoning are related to solder paste quantity, land area sizes, solder mask between pads, thermal gradient between the two pads as some pads have a larger heat sinking
| https://www.smtfactory.com/I-C-T-LV733-LV-Series-Vacuum-Reflow-Oven-Machine-pd44543571.html
. Linear profile With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along an identical linear temperature gradient
