Electronics Forum | Mon Mar 06 17:57:39 EST 2006 | slthomas
Not here, but I'd be interested in hearing what you found.
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Industry News | 2013-05-13 14:06:16.0
Leading analysts IDTechEx find that the total market for printed, flexible and organic electronics will rocket from $16 Billion in 2013 to $77 Billion in 2023. The majority of that is OLEDs (organic and soon to be printed) and conductive ink used for a wide range of applications of printed electronics. This market will experience 14.5% CAGR over the next 5 years.
Industry News | 2012-04-09 12:06:44.0
With the rapid development of the LED industry, China has become a major production and export hub
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
-, medium- and low-temperature areas on components). In general, area with the highest temperature lies in the middle of edges without c omponents perpendicular to the direction of transmitting the PCBs; area with the lowest temperature lies at the soldered
ORION Industries | http://orionindustries.com/steel-rule-die.php
% in the direction of the grain, due to changes in humidity. Therefore, a 10 part could expand up to 0.2. Also, soft and dense foams and rubbers can have distorted edges when die cut
