With the July2006 ROHS deadline approaching SigmaPrint Technologies are now able to supply colour coded �green� Squeegee assemblies. Colour coded squeegees are of great help to customers who are exempt from the directive, helping to ensure that the
New Equipment | Cleaning Agents
440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R
Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef
Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Industry News | 2016-02-10 15:50:38.0
SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
| https://www.eptac.com/faqs/ask-helena-leo/ask/bridging-two-adjacent-pins-on-an-ic
. Verify the wire solders properly to the leads, i.e., good wetting to both wire and component leads. If the wire is a small enough gauge, then it can be wrapped around the component lead and that would also be acceptable. See section
| http://etasmt.com:9060/cc?ID=te_news_industry,26562&url=_print
. Dual on-the-head cameras systems are perfect solution. The ability to have this broad component range leads to easier line balancing for drastically different PCB designs as well as the capability to sustain the highest placement rates possible, with very little derate
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