Industry Directory | Manufacturer
Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.
Industry Directory | Manufacturer's Representative
Inverter.com is a branch online store of ATO USA, specializing in the sales and technical service of 12V/24V/48V pure sine inverters, grid-connected/off-grid solar inverters, solar water pumps etc.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Equipment
Pin Grid Array Extractors are available in two sizes and provide a quick and safe way to extract Pin Grid Array components from their sockets. All component sizes can be accommodated, as the tool is available in two or four grip models. Adjusting the
Electronics Forum | Fri Nov 26 09:18:55 EST 2021 | bukas
Hi, has any of had a problem with power grid in you factory? Do you use EMI filters, power factor regulators or similar? Is there a known type of equipment that causes voltage/current harmonics and other interferences? thank you
Electronics Forum | Tue Nov 30 07:40:26 EST 2021 | bukas
thank you for information. my problems did start sometime around lighting upgrade 4 years ago. we bought some cheap led panels about 150-180 of them in total...
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Max PCB Size: 508*508 Camera/Vision System : Green digital camera Camera res.: FOV 5x8.5 mm Tooling: Grid Lock/Magnetic
Industry News | 2003-04-04 07:39:52.0
Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Parts & Supplies | Screen Printers
Size: 580 * 580 Applicable models:DEK Printing Machines
Parts & Supplies | SMT Equipment
Steel grid (new) of DEK Size: 580 * 580 Applicable models:DEK Printing Machines Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
-off-the-shelf ball/column grid array packaging (COT
Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment by: Jim Hines, Adam Stanczak
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_universal-grid-system_topic2404.xml
PCB Libraries Forum : Universal Grid System PCB Libraries Forum : Universal Grid System This is an XML content feed of; PCB Libraries Forum : Questions & Answers
| https://www.wesource.com/dek/dek-grid-lok-gold-12-lot-of-3-id-000913-5/22/
DEK Grid-Lok Gold 12" (Lot of 3) ID_000913 (5/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
