Industry Directory | Manufacturer
Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.
Industry Directory | Manufacturer
Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Assembly Services
Premium Automatic PCB Support for SMT Processes Ovation’s award-winning Grid-Lok Gold™ automatic substrate support technology provides electronics manufacturers with a robust alternative to costly and often problematic dedicated fixture plates. Set
Electronics Forum | Thu Feb 16 09:37:11 EST 2006 | mgillespie
hi, > > we tried to introduce form-flex a few > years back and it caused more problems than it > fixed. > > Switched back to pins and no > problems. > > It might have improved since but I > would be reluctant to get them again unless I was >
Electronics Forum | Thu Feb 16 03:43:54 EST 2006 | aj
hi, we tried to introduce form-flex a few years back and it caused more problems than it fixed. Switched back to pins and no problems. It might have improved since but I would be reluctant to get them again unless I was given a 6 month trial!! aj
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Software version: 09SP13P02 Details: • Green Camera • Under Stencil Wipe • Vacuum • Edge Clamping • Grid Lok® Ready
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Everything You Need to Know About X-Rays
Career Center | Pullman, Washington USA | Engineering
The Opportunity: Schweitzer Engineering Laboratories (SEL) seeks a professional, innovative and detailed individual for our Manufacturing Engineer position. If you are looking for an opportunity to contribute your skills and abilities to our growing
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Lewis & Clark | http://www.lewis-clark.com/product-tag/horizon-03/
: Horizon 03iX Vintage: 2011 Software version: 09SP13P02 Details: Green Camera Under Stencil Wipe Vacuum Edge Clamping Grid Lok® Hook up Dropbox to additional photos: https
| http://www.feedersupplier.com/product/278122660
.com DEK Europa screen printer with 2D inspection ← → Product Details DEK Eur opa Configuration : DEK Europa 2D inspection, Hawkeye 750 Camera, Grid-Lok Tooling system, QC Calc Dongle, Under Stencil Cleaner- 510mm with vacuum, Magnetic Board Support, Temperature Control Module (TCM), Input: AC220V--240V 分享此页面 版权所有 © GOLDLAND ELECTRONIC TECHNOLOGY CO
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