Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer / Manufacturer's Representative
We specialize in EMI Ferrite Core, Thermal Pads, Gaskets and shielding products.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Used SMT Equipment | Repair/Rework
SPLIT VISION MICROSCOPE STEREO WILD M3Z MICROSCOPE WITH ZOOM LENS COLOR DIGITAL CAMERA CAMERA MONITOR REMOTE KEY PAD CONTROLLER AIR/NITRO INLET INCLUDES 3 EACH NOZZLES FOOT SWITCH FOR GAS FLOW TOP AND BOTTOM 800 WATT HEATERS VENTURE VACUUM SYSTEM GRO
Used SMT Equipment | Adhesive Dispensers
USED - FUJI GL-V 5000 GLUE MACHINE TERMS: Items listed under USED condition are not tested, condition is not known and the item is being sold “AS IS” unless stated otherwise. Condition of item will be n
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Parts & Supplies | Assembly Accessories
amaha Mounter: also known as "mounting machine" and "surface mounting system", in the production line, it is a kind of equipment that can accurately place surface mount components on PCB pad by moving the mounting head after dispe
.JPG)
Parts & Supplies | Pick and Place/Feeders
J44021035A PC_POWER_SUPPLY J48011017A SBC NuPRO-935A/DV &n
Technical Library | 2014-09-11 11:36:46.0
There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
. This was and is expensive. The via-in-pad must be plugged, plated over and planarized flat. Any dimple will trap air and cause Ball Voiding
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) resulted in significantly more voids in BGA/CSP solder joints than no Via in Pad design The voiding percentage in area or diameter of the BGA solder joints did not correlate to the failure cycle in thermal cycling (Figure 7) Figure 7. Scatter Chart Showing
