Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Industry Directory | Consultant / Service Provider
A printed circuit board design service bureau located in the great Pacific Northwest. We specialize in large, complex, fast turn designs common in the video processing and data processing industries.
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New Equipment | Cleaning Equipment
Fully Automatic Stencil Cleaning System BMP-750 Features ▶All stainless steel body, beautiful, wear resistance, corrosion resistance, in line with environmental protection requirements and standards. ▶The fully pneumatic operation, no electricity, t
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Technical Library | 2024-10-26 06:26:24.0
Copper pour is an essential design element in printed circuit boards (PCBs) that enhances thermal management, signal integrity, and electrical grounding. It involves filling unused areas on the board with copper, connecting them to power or ground planes. This feature helps manage heat dissipation, minimizes electromagnetic interference (EMI), and provides stable electrical grounding for complex circuits. While copper pour offers significant benefits, improper implementation may lead to manufacturing challenges like warping or soldering difficulties. This article explores the advantages of copper pour, the potential challenges, and how PCB Power integrates this design feature to optimize performance and durability. With advanced manufacturing processes, PCB Power ensures seamless copper pour integration for prototypes and large-scale production, offering turnkey PCB solutions for various industries.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Beaumont, Michigan, Minnesota, Canada USA | Engineering
Infrared camera electronics design and camera design engineer. Manage electronic design, research and development, optimize current design, manage prototype design, fabrication and testing. Some optical design experience is preferred, but not not nec
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
| https://www.smtfactory.com/How-to-prevent-static-electricity-during-the-operation-of-the-Full-auto-SMT-Production-Line-id3182659.html
Series Reflow Oven LV Series Vacuum Reflow Oven SMT Stencil Printing Machine Semi-auto SMT Stencil Printer Full-auto SMT Stencil Printer Pick
| http://etasmt.com/cc?ID=te_news_bulletin,25362&url=_print
temperature profiles Description: The Ersa HOTFLOW 4/26 Reflow Soldering System is of robust design and manufactured entirely from steel, welded air-tight, powder coated and with interior electric cabinet and a PC operating terminal
