Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Rework & Repair Equipment
Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i
Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020
Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
| https://www.eptac.com/faqs/ask-helena-leo/ask/gullwing-lead-deformation
Gullwing Lead Deformation - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| http://etasmt.com/cc?ID=te_news_bulletin,23569&url=_print
: wicking A Wicking Defect is the flow of solder either up the lead of the component or along traces and possibly under insulation and through via holes
