Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
diviation equally on PCB to avoid any thermal shock to the components(fast temperature ramup will damage the comonents), when doing this, Pick and place machine also need the output capacity of the reflow oven is big, so nowadays the 10 heating zones reflow oven an 12 heating zones reflow oven become the widely used
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
phases in the Pb-free microstructure. RESULTS Solder Joint Void Characterization The factory x-ray inspection on the conventional or standard SMT (STD SMT) reflow assembly revealed substantial void content in the BGA solder joints of both components. The x
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