New Equipment | Industrial Automation
SANDY.[MAILTO:UNITY@MVME.CN] SANDY.[WHATSAPP/SKYPE/MOBILE:+8618020776786] SANDY.[QUOTE TO YOU WITHIN THE SHORTEST POSSIBLE TIME WITH OUR BEST PRICE] WARRANTY: UP TO 12 MONTHS SHIPPING: FAST DELIVERY IS AVAILABLE NEW+ORIGINAL+IN STOCK+ONE YE
Electronics Forum | Mon Jul 07 15:47:42 EDT 2003 | randywomack
Russ and DaveF, thank you for suggesting to Tejas to look for a vendor willing to consider retrofits. Sensbey has had much success implementing the HAK technology.
Electronics Forum | Thu Feb 23 09:30:45 EST 2006 | Rich
I would stay clear of this machine, had one and after a few years of use gave a lot of electrical problems, they are no longer supported by electrovert for electrical spares. Ours was a dual wave with HAK, 3 phase 380 volt.
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Parts & Supplies | SMT Equipment
KG7-M9123-00X GUIDE 1 4 KG7-M9124-00X PLATE 1, GUIDE 1 KG7-M9125-00X PLATE 2, GUIDE 1 KG7-M9126-YYX SET COLLAR 2 W390 KG7-M912A-00X BRACKET, SENSOR 2 KG7-M9127-00X STOPPER, LOCATE PIN 1
Parts & Supplies | Pick and Place/Feeders
KXFB02QQB01 BRACKET 0 KXFB0210A00 PIN 0 KXFB04W5A00 BRACKET 0 KXFX03EHA00 PRESSURE-SW ISE30-01-25-M-X114 N510066819AA JOINT KQ2N04-M5A KXF0DR2AA00 JOINT GWS6-8 N210022436AB COVER 0 N210035700AA HOLDER 0 KXFB04UJA00 GUIDE 0 KXFB0AQ7A00 STOPPE
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
