Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron
Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled
Industry News | 2012-10-16 18:56:39.0
IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.
Industry News | 2011-04-22 22:48:40.0
IPC has released verified attendance figures from IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas, indicating an eight percent increase over last year with 7,208 total participants.
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
europlacer iineo, flexible smt placer, in real production
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
: Consider Halogen-Free Flux and Solder Paste Back to all posts Part 2 of 2 – The Need for Halogen-Free Materials and the Impact on Your Electronics Manufacturing Process By John Vivari What will happen if halogen-containing substances are banned from use in electronics manufacturing
.gif)
