Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2015-04-09 19:50:17.0
Aqueous Technologies announces that its CEO Michael Konrad presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Konrad presented “Low Standoffs, High Densities, and High Reflow Technologies. The Challenges of Modern Day Cleaning.
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Coomb's Printed
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
percentage, with the technology drivers already discussed for advanced nodes. IV. IMPORTANCE OF SURFACES Oxides and surface contamination prevent good wetting of molten solder onto solderable surfaces [8] and hence are associated with voids. The metal surfaces
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