Trend Harvest Int'l Development Ltd is well- established company in the field of telecom- munication in Asia. Our head office is located in Hong Kong.We have our own well-managed factory in Guang Dong Province P. R. of China and an overseas branch of
Industry Directory | Manufacturer
"Deere & Company (NYSE: DE) is a world leader in providing advanced products and services and is committed to the success of customers whose work is linked to the land - those who cultivate, harvest, transform, enrich and ...
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Industry News | 2015-02-18 14:38:15.0
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D. The company became the first OEM to successfully complete an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2017-08-04 15:03:08.0
SCP-2801 Power Modules include all the components that are required to harvest energy from ambient light, charge a built-in rechargeable battery, and deliver a stable voltage to a load.
Technical Library | 2021-07-13 19:59:34.0
We have investigated the processing of lead-zirconate-titanate-based thick films by inkjet printing Pb (Zr0.53Ti0.47)0.98Nb0.02O3 with a 6 mol% excess of PbO nanosized powder dispersed in water. Differentwaveforms were employed to determine the optimum size and shape of the drops. A uniform, defect-free pattern with dimensions of 4 mm × 4 mm can be printed using 20 V and a drop spacing of 20 μm. The inkjet-printed films were heated to 400 °C to remove the organics and subsequently sintered at 750 and 850 °C. The correlations between the density, grain size and electromechanical properties of the thick films and bulk ceramics are qualitatively discussed. A thickness coupling factor of 46% was obtained for a 15-μm-thick film sintered at low temperature of 850 °C, which is comparable to the value of the bulk ceramic with an identical nominal chemical composition. Our results are important for the economic and environmental-benign printing of piezoelectric materials applicable in variety of electronic devices, such as sensors, actuators, transformers, piezoelectric energy harvesters and transducers.
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Printed Electronics USA
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Wearable Europe - Wearable Technology Applications and Commercialisation
Career Center | chennai, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Two years working in EMS(process and Equipment Engineer)