Electronics Forum | Wed Apr 28 08:48:34 EDT 2004 | davef
Daeshung!!! Gazoontite!!! We think someone tried to trick you. Look here: http://www.daesungmicron.com/product_eng.htm
Electronics Forum | Mon Aug 02 13:10:26 EDT 2004 | jbabson1
Fuji has a local rep in Florida and a field eng. in Tampa.
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2023-03-06 17:25:27.0
Kenneth Harris II, Eng.D. will deliver the opening keynote at Electrical Wire Processing Technology Expo (EWPTE). Acknowledged by Forbes Magazine as one of the world's youngest and most influential individuals in the field of science, he will present "Building the Future," on Wednesday, May 17, 2023, at the Wisconsin Center in Milwaukee, Wis.
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Raleigh, North Carolina USA | Engineering
Title: SMT PROCESS ENGINEER Salary: 70k-80k max rate with great benefits Job Description: ESSENTIAL DUTIES & RESPONSIBILITIES To perform this job successfully, an individual must be able to perform each essential duty satisfactorily, plus w
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
Career Center | Noida, India | Maintenance,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
What is really inside your AOI? What is really inside your AOI? by: Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun; Vi TECHNOLOGY Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_to220-vertical-pin-positions_topic2428.xml
: Thanks a lot!!! , this is just... Author: Eng. Jesus MoraSubject: 2428Posted: 17 Jan 2019 at 10:41amThanks a lot!!! , this is just what i needed  
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