New Equipment | Solder Materials
ALPHA® wave solder and soldering bar metals (wave soldering alloys) offer best value soldering performance – quality solder bar metals products at the lowest cost of ownership, and thanks to a global copy exact product policy, consistency of wave sol
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Electronics Forum | Tue Jun 26 19:48:29 EDT 2001 | davef
Information a SIR test vehicle can be found in IPC-9201, SIR Handbook [http://www.ipc.org]. Common test boards are: * IPC-B-24 (copper and HASL, FR-4 and polyimide) * IPC-B-36 (bare copper and HASL, FR-4 and polyimide) * IPC Phoenix board (bare copp
Electronics Forum | Thu Aug 27 02:55:11 EDT 2009 | smtirl
Alloy is Sn/Pb on a HASL finish. Standard no-clean flux reflowed in Nitrogen.
Industry News | 2008-09-12 01:24:36.0
GREELEY, CO � September 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 401 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Industry News | 2008-10-07 21:14:49.0
GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 402 at the upcoming Mexitr�nica exhibition scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, Mexico.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm
Events Event Calendar Call for Participation Conferences & Symposia SMTA International Additive Electronics China Conferences Counterfeit Symposium Electronics in Harsh Environments Cleaning
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
