High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
At Present the company is concentrating to meet Quick turn around/prototype and a Pilot Order requirement of :- Double Sided Pth & Multilayer upto 12 layers Printed Circuit Bare Board Material FR � 4 ( Nema � Grade ) with board thickness as per cus
Electronics Forum | Wed Nov 12 08:50:08 EST 2008 | greene08
I am trying to find a standard for HASL - especially for small pitch devices. Are there better options than HASL for boards with a large amount of small pitch IC's??
Electronics Forum | Mon Feb 21 10:05:33 EST 2005 | Dougs
Our machines can place components down to 16mil, I've never seen any finer pitch components in use, what pitch are they going down to now? 12mil??? What pitches have you been using? We are a contract manufacturer so customers sometimes supply free
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
ASCEN Technology | https://www.ascen.ltd/Products/auto_optical_inspection/517.html
. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
– Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price Abstract 29-2 Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements Cong Zhao, Chaobo Shen, Zhou Hai
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