Electronics Forum | Fri Sep 12 13:14:33 EDT 2003 | Mark Kostinovsky
A little adition to Norm's statement: Sn-Pb intermettalic compounds do not accept solder as they are (even without being oxidized).
Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg
I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal
Industry News | 2019-04-03 20:07:41.0
Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Industry News | 2021-01-21 08:09:52.0
Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Technical Library | 2014-01-30 18:08:04.0
As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
winsouce.jpg)
