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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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Our products including Type-C, HDI PCB, Special Crafts PCB, Cu./Al. Base Material PCB, Mass Multi-layer PCB etc., which are are mainly applying to the fields of Cell Phone, Computer Peripherals, Consumer Electronics, Digital Produ
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The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
Electronics Forum | Sat Apr 30 11:34:23 EDT 2016 | huanyupcb
High Mix,Low Volume,Short Delivery PCB Supplier. 1.The world top 500 PCB supplier.( Samsung DELL Alcatel-Lucent Huawei Lenovo FOXCONN ASUS etc ) 2.Over 15+ Years of PCB Expertise. 3.Provided "PCB & Assembly One-stop shop"service,No MOQ. 4.ISO9001 I
Electronics Forum | Wed Aug 02 23:28:44 EDT 2017 | dawson
there are many ideal pcb manufacturers can reach your requirements. multi-layer and hdi boards, you can try and test http://www.madpcb.com
Industry News | 2003-02-14 08:35:56.0
Printed Circuit Design & Manufacture: The Resource for Electronic Interconnect Professionals will Launch Its Premier Issue in April 2003
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Technical Library | 2021-12-21 23:21:34.0
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,
Ultra High Density Interconnect Conference
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/hdi-material-selection_topic3243.html
HDI Material selection - PCB Libraries Forum Forum Home > Training / Events > PCB Design Basics New Posts FAQ Search Events Register Login HDI Material selection
Blackfox Training Institute, LLC | https://www.blackfox.com/3-rising-pcb-assembly-trends-in-2021/
. Manufacturers can fit more features in lesser space, allowing devices to perform more tasks than ever. As the need for more IoT products continues to rise, expect HDI PCB to become the standard for all circuit boards
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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