Fully Automatic Pick &Place Machine -Online Automatic from Shenzhen ,CHINA Specifications: Model LEAD-2206 Working Type Online, Fully automatic Mounting Heads 6 Pieces
Electronics Forum | Fri Jan 16 10:54:21 EST 2009 | realchunks
Hi Steve, Make sure your spray head is all the way down. If so, try slowing your rate of speed over the part. Which head are you using to coat this part?
Electronics Forum | Fri Feb 17 17:46:39 EST 2006 | grantp
Hi, Where are you heading? Regards, Grant
Used SMT Equipment | Pick and Place/Feeders
Full In line Machines Installed 2007 Vintage Hydra Heads on Both My 12e and My 15e Line Scan on Both machines Shared database Electrical 2 pole test on Both Machines Qty 1 TEX Tower 2.9.2 Software Rev
Industry News | 2022-03-03 16:04:03.0
The European EMS industry grew 9 percent from 2020 to 2021 to exceed 44 billion Euros according to the annual survey results collected and analyzed by in4ma, the market research arm of Weiss Engineering. IPC has partnered with Weiss Engineering since 2020 to deliver industry intelligence to the European electronics community. The 2021 result represents an all-time high for the industry beating the 2019 result by 1 percent.
Industry News | 2010-08-31 12:11:44.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6–7 October, 2010.
Parts & Supplies | Pick and Place/Feeders
CM High-speed 12-nozzle head used in smt machine
Parts & Supplies | Pick and Place/Feeders
CM High-speed 8-nozzle head used in smt machine
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 2023-09-05 21:00:53.0
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider
europlacer iineo, flexible smt placer, in real production
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/why-invest-in-inventory-management
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KingFei SMT Tech | https://www.smtspare-parts.com/sale-36275179-ys24-head-io-board-kke-m4570-010-i-o-head-board-assy.html
YS24 Head IO Board KKE-M4570-010 I/O Head Board Assy Leave a Message We will call you back soon! Your message must be between 20-3,000 characters