Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc
Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI
Electronics Forum | Wed May 21 09:03:52 EDT 2008 | bing007
I have been confronted with a MPM with a rheometric pump head on and have not had much to do with these. It is giving varying results on the down line paste AOI and is not responding very much to changes in pressure, speed etc. It is a 16inch pump, w
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
Parts & Supplies | Pick and Place/Feeders
Yamaha main stopper on YV100II KU0-M9160-01X Yamaha parts: 1 KV7-M9161-00X PLATE,STOPPER 1 2 KV7-M9162-01X BRKT.,STOPPER 1 3 KV7-M9163-00X STOPPER 1 4 KV7-M9164-00X BRKT.,CYLINDER 1 5 KV7-M9165-01X CYLINDER:PDAS6X40 1 6 KV7-M9166-00X GUIDE (LW
Parts & Supplies | Pick and Place/Feeders
Single pendulum on JUKI FF 16MM feeder wheel 40001982 OCC A LIGHT PCB ASM 40002065 Y-AXIS LMT CABLE ASM 40002066 X-AXIS LMT CABLE ASM 40002068 YL LMT SENSOR ASM 40002069 +YL LMT SENSOR(TRAY)ASM 40002070 +YL LMT SENSOR(FEEDER)A 40002072 HEAD
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 2023-09-05 21:00:53.0
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/uc205-pillow-block-227935?page=11&order=list_price+desc
Pillow Block | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Pillow Block Public Pricelist Public Pricelist Pillow Block
| https://www.feedersupplier.com/sale-14347874-universal-ai-head-2-on-21307107-smt-ai-machine-spare-parts.html
Universal AI HEAD 2 ON 21307107 SMT AI Machine Spare parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411