Industry Directory | Manufacturer
IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Convection Heating Pressure Curing Ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for both R&D and high volume manufacturing applications. Multiple cleanroom and au
Used SMT Equipment | Soldering - Reflow
2022 Essemtec RO300FC Reflow Oven Demo Never Used in Production Reflow Oven The Essemtec RO300FC is a full convection reflow oven designed for the reflow soldering of lead-free solder pastes and the curing of adhesives. Here are some key features
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Used SMT Equipment | Soldering - Reflow
Speedline Electrovert Omnimax 10 Oven Manufactured Year: 2012 Voltage: 380, 3 Phase 10 Zones Oven, Top and Bottom Heated Length: 3.855 mm 3 Cooling Zone Cooling Length: 1.293 mm Reflow Operating Temperature: 350 C Curing Operating Tem
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Technical Library | 2015-07-27 16:58:29.0
When it comes to the application of conformal coating, curing the coating plays a key role in the circuit assembly and selective conformal coating process. Curing conformal coating occurs after the coating spray/dispense process is complete. The coating is considered “cured” when the conformal coating on the circuit assembly is sufficiently tack-free to be handled. Curing can sometimes be accomplished at room temperature but takes a considerable amount of time to dry. Accelerated conformal coating curing decreases this drying period, the cure process reaches either the tack-free or a fully dried state but not quite having fully cured properties. Accelerated curing techniques include one or a combination of heat, moisture, UV light, and chemical reaction curing. This article focuses primarily on thermal or heat curing.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
IR Oven Curing Oven - Fast and Uniform Heating for Superior Results Product Description I.C.T IR oven is cost-effective Curing Oven produced by I.C.T, mainly to deal with the application of glue curing,special soldering,SMD testing, Anti-corrosi
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YINCAE Showcases High-Performance Materials at IMAPS 2025
Career Center | , Mississippi USA | Engineering,Production
About The Company: This company is a supplier of aerospace and defense products to the U.S. Government and its allies and major prime contractors. This company holds market leadership positions in munitions, smart weapons and precision capabilities
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2019/08/pressurecureoven.pdf
Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-hotmelt-application.php
. Masking materials can also be formulated as a hot melt. Hot melt is an excellent choice because it solidifies rapidly when fluid temperature decreases to ambient, thus eliminating the extra steps of air cure, UV cure, and oven heat cure typically required
