Industry Directory | Other / Manufacturer
TTi makes standard and custom thermal platforms, Hybrid Benchtop Temperature Chambers which combine the benefits of a small benchtop chamber with a separately controlled thermal platform for speed, uniformity versatility.
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Soldering Robots
PCB Hot Bar Soldering Equipment High Precision Electric Soldering Machine for FPC Fpc Soldering Machine Size 590*640*620 mm Max.working area (soldering area ) 200*260 mm Working
Used SMT Equipment | Stencil Cleaners
SmartSonic Ultrasonic Stencil Wash • Model: 529 • Year: 2018 • Enviroguard-P Filtration System • Hand-Held Spray Rinse • Hand-Held Air Blow-Off • Footprint: 21.8" x 35.5" x 31"H • Wash Tank Dim
Used SMT Equipment | In-Circuit Testers
60 dB Fiber cleave length: 10 mm each Fiber observing direction: X and Y (2 axes) Fiber viewing method: 5" TFT color LCD monitor with anti-reflection coating Splice loss estimating function: SM, MM and DS fibers Number of splice modes: 30 progra
Industry News | 2016-01-05 16:10:10.0
Novel method for protecting electronic components from heat.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
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Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Events Calendar | Mon Sep 29 18:30:00 UTC 2025 - Tue Sep 30 18:30:00 UTC 2025 | San Diego, California USA
YINCAE Showcases High-Performance Materials at IMAPS 2025
Career Center | Tewksbury, Massachusetts USA | Engineering
Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech
Career Center | Tewksbury, Massachusetts USA | Engineering
Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech
Career Center | Lindenhurst, Ajman | Engineering
� Entrepreneurial and management skills, efficient in computer tools, worked in ISO9000 environment; adept to product certification process in hi-tech industry. Supervised at times up to 40 engineers and other professionals. Tolerates ambiguity and p
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
