Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Electronics Forum | Wed Dec 05 02:01:51 EST 2007 | lococost
We've done some tests on this and got good results. Of course it can be dependant on the paste properties (thinking of slump in particular), and you need to get the heat under the connector which can be more critcal than in a leaded evironement, but
Electronics Forum | Thu Sep 07 03:47:07 EDT 2006 | vicknesh28
I have been getting non wets on fine pitch QFP packages on random leads during reflow process. I noticed that every time there is some flux residue left between the non-wet lead and the solder pad. No residue was not observed on the rest of the good
Industry News | 2012-10-24 09:24:51.0
Recently, compounds found in surfacemount adhesives (aka: SMA's, chipbonders) were classified as dangerous goods (UN3077 & UN3082) resulting in an immense increase to the end user’s cost due to the new classification regarding transport costs.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
