Industry Directory: heavy assembly packaging (249)

Golden State Assembly

Golden State Assembly

Industry Directory | Manufacturer

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

UNISOFT Corporation

UNISOFT Corporation

Industry Directory | Consultant / Service Provider

PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!

New SMT Equipment: heavy assembly packaging (412)

Unisoft ProntoPLACE

Unisoft ProntoPLACE

New Equipment | Software

ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig

UNISOFT Corporation

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

New Equipment | Software

If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you!  ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly

UNISOFT Corporation

Electronics Forum: heavy assembly packaging (529)

PWB packaging for shipment and storage

Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz

Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor

Re: Double sided assembly

Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman

Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an

Used SMT Equipment: heavy assembly packaging (53)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha original YS88 multi-function module chip mounter

Yamaha original YS88 multi-function module chip mounter

Used SMT Equipment | SMT Equipment

Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: heavy assembly packaging (3636)

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Industry News | 2017-09-16 02:29:39.0

Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Heller Industries Inc.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Parts & Supplies: heavy assembly packaging (419)

Universal Instruments FINGER

Universal Instruments FINGER

Parts & Supplies | Assembly Accessories

FINGER 47152202 Finger For Tolo 21-0001-001  Suneast finger V type A62045CT  ​ Finger Cleaning Brush 21-0001-005  Finger Valve VHK3-12F-12F  Right Finger Brush For JT MPS-350 Wave Oven   ​ FINGER VALVE P

Qinyi Electronics Co.,Ltd

Juki JUKI/Tokyo Heavy Machine Safet

Juki JUKI/Tokyo Heavy Machine Safet

Parts & Supplies | Assembly Accessories

Long-term spot supply of JUKI original accessories: Juki KE 730/750 Laser(both new and used): E9631721000 Model: 6604054 Juki KE 740/760 Laser(both new and used): E9635721000 Model: 6604096 JUKI KE 2050/2060 / FX -1R Laser Original New Original Pa

KingFei SMT Tech

Technical Library: heavy assembly packaging (99)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Videos: heavy assembly packaging (255)

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Example of how to import CAD data and BOM files, and export to a Selective Soldering machine program setup file.

Videos

www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog

UNISOFT Corporation

Training Courses: heavy assembly packaging (9)

Component Indentification Certification

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: heavy assembly packaging (42)

Wafer-Level Packaging Symposium

Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA

Wafer-Level Packaging Symposium

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC)

Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA

International Wafer-Level Packaging Conference (IWLPC)

Surface Mount Technology Association (SMTA)

Career Center - Jobs: heavy assembly packaging (122)

SMT Stencil designer/CAD designer for the local electronic assembly industry

Career Center | San Diego, California USA | Engineering,Management,Production

Customer interaction, inventory and delivery of Stencils. In charge of the Satellite Operation in San Diego, Ca. Report to Headquarters in Lake Forest, Ca. Duties and responsibilities: Take full responsibility for the Satellite Operation facility.

I-Source Technical Services, Inc.

Sr SMT Engineer

Career Center | Herndon, Virginia USA | Production,Quality Control,Technical Support

Growing and profitable company seeks an SMT Engineer with Heavy front end experience - 10 plus years SMT experience.  Hands-on experience in interfacing with design engineers in influencing design with DFx techniques - Design for Fabrication(DFF),  D

SWG

Career Center - Resumes: heavy assembly packaging (48)

Customer Service Engineer

Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support

Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: heavy assembly packaging (1085)

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

Partner Websites: heavy assembly packaging (23408)

E36157290A0 JUKI 510 Nozzle Assembly Japan Original Foam + Carton Packaging

KingFei SMT Tech | https://www.smtspare-parts.com/sale-12696080-e36157290a0-juki-510-nozzle-assembly-japan-original-foam-carton-packaging.html

E36157290A0 JUKI 510 Nozzle Assembly Japan Original Foam + Carton Packaging Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

Lead free Reflow Ovens for Printed Circuit Board Assembly and Semiconductor Packaging-Customization

| http://etasmt.com:9060/te_product_i/2020-04-10/12429.chtml

Lead free Reflow Ovens for Printed Circuit Board Assembly and Semiconductor Packaging-Customization Reflow Oven-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About


heavy assembly packaging searches for Companies, Equipment, Machines, Suppliers & Information

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Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

PCB Handling Machine with CE

Training online, at your facility, or at one of our worldwide training centers"
Solder Paste Dispensing

High Throughput Reflow Oven
IPC Training & Certification - Blackfox

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.