Industry Directory | Manufacturer
VisionMaster is the original longtime manufacturer of advanced yet affordable 3-D solder paste inspection (SPI) equipment. VisionMaster provides best-in-class 3D white light technology and repeatability at laser technology prices.
Like all other VisionMaster equipment, the M500 uses advanced white light Moiré interferometry to build height data for every pixel in the view. VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this
VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a
Electronics Forum | Wed Sep 07 03:03:35 EDT 2005 | Milroy
I am engaged with SMT production and we are going to have a brand new SMT line and I am studing about the screen printing and I have seen most commonly used stencil thickness is 6mil and I need to know what is the best solder paste height we can achi
Electronics Forum | Thu Sep 08 03:40:59 EDT 2005 | GS
do not forget also wich Type of paste used( granulometry) if Type-3 ? Type 4? etc, it could change in final metal on your pads/joints. Regards GS
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Career Center | Yishun, Singapore | Maintenance
To : Sir/Madam Subject: Apply for Job Dear Sir/ Madam, I write to enquire if there is a vacancy for a SMT Maintenance Engineer in your firm.I am 40 years old a permanent resident of Singapore with an IC # S6863162i and i'm still work
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
SMT Express News &##149; Forums &##149; SMT Equipment &##149; Company Directory &##149; Calendar &##149; Career Center &##149; Advertising &##149; About FREE Company Listing! Parvus Announces Availability of OrbiTrak™ GSM, a PC
components within the PC board structure is not a new c
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
! Additional details available on request. Condition: Complete & Operational Location: USA / FOB Origin Availability: Immediate Pemtron TROI-7700 HL SII 3D Solder Paste Inspection System- 2017 Make: Pemtron Model
| https://www.smtfactory.com/I-C-T-High-Speed-on-Line-3D-SPI-Solder-Paste-Inspection-Equipment-I-C-T-S400-pd49143724.html
I.C.T High Speed on-Line 3D SPI Solder Paste Inspection Equipment I.C.T-S400 from China manufacturer - Dongguan Intercontinental Technology Co.,Ltd. English Français Pусский Español Português Deutsch Italiano 日本語 한국어 Tiếng Việt
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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