Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
Electronics Forum | Thu Jan 20 14:46:26 EST 2011 | dscott6977
Just wondering if anyone has a Heller reflow oven and is currently or in the past use Tribol 1421 high temp chain oil. Thanks.
Electronics Forum | Tue Feb 01 14:18:20 EST 2011 | markyen
We have Heller oven for over 8 years now and we use Heller industries Inc. Edge holder chain lube Part number: 680784 Overon F232-iso vg 220
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Used SMT Equipment | Soldering - Reflow
Hello and thank you for your interest in our Heller 1088EXL Reflow Oven. See attached pictures and information Heller Reflow Oven Model Number: 1088EXL Serial Number: 0201DA1A1-53956 Year: Feb 2001 Left to Right Process Flow 8 heating zone for
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
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Parts & Supplies | Pick and Place/Feeders
HELLER - SPARE PARTS HC1 TEMPRERATURE CONTROLLER .HC1 Rotary Encoder Heller ..E40H12-200-6-L-B Motor for Heller oven ..86YSY80-2 HEATER OF HELLER ..HEATER OF HELLER Reflow Heller Heater ..HL-255 Heller Motor JF1F071N Encoder
Parts & Supplies | Assembly Accessories
HELLER REFLOW MK5 MOTOR K41MYAAS-1015 originla new Specifications: Brand Name HELLER MOTOR Part number K41MYAAS-1015 Machine Model Heller MK5 Ensure Test in machine before shipping Guarantee Original 100% and working
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Surfside Beach, Texas USA | Engineering,Management
Milti-Billion dollar company seeks a Director of Operations. The ideal candidate will have 10 to 15 years experience in the Electronics industry, approximately 8 years in management and 3 years in senior management capacity. Must have experience wi
Career Center | Tempe, Arizona | Production
Insert components into a printed circuit board in preparation for soldering. Inspect own work and team members for defects. Properly document problems that occur. Kit parts using bar code reader. May set up and operate automatic machines that are com
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
SMTnet Express, May 14, 2020, Subscribers: 29,151, Companies: 11,003, Users: 25,794 Reliable Selective Soldering For High Volume Assemblies Credits: ITW EAE The number of through hole connections on a circuit assembly are decreasing with the drive
Heller Industries Inc. | https://hellerindustries.com/parts/6815c/
6815C - HIGH TEMP RTV Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/temp-cond-hoses?con=t&page=3
Temp Cond Hoses Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
