1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
Electronics Forum | Wed Apr 27 11:13:41 EDT 2011 | jhinckley
I have a 1800w that the main contactor will not pull in. When i push the contactor in manualy the power goes through but nothing turns on, when i push in the fan contactors all fans come on. The programs seem to load butnothing happens and the sp and
Electronics Forum | Fri Aug 16 03:13:32 EDT 2013 | rollon65
Hi Marcelo. I have used 2 non EU model 4C machines since 2002 that do this almost every time from a cold switch on. My local Tyco tech guy said that they all do it. They are still going after 12 years. I have another EU machine that does the sam
Used SMT Equipment | Soldering - Reflow
Heller Reflow Oven 1800EXL Instaled new in 2000 (manufactured Dec 1999) Hours: 34K Edge and Mesh Power: 480V Condition: Working, As Is Where Is, Just taken off line Availability: Immediate Location/Shipping: NH/FOB origi
Used SMT Equipment | Soldering - Reflow
Heller 1707 Mark III Reflow Oven Equipment Description Heller Model Number: 1707MK-III Serial Number: 0815N3-B7A2S-301451-05 Year 8/2015 Edge Rail and Mesh Belt Temperature: 350C Lead Free 7 Zones Top and Bottom Windows XP O/S Power: 208-
Industry News | 2023-04-19 17:43:01.0
As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Parts & Supplies | Assembly Accessories
HELLER REFLOW MOTOR CP6383 CBM-9230 Capacitor -run induction motor Model Number CBM-9230 CP6383 Input Voltage 210-240V Frequency 50/60 Hz Power 83W
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Parts & Supplies | Pick and Place/Feeders
47561117 nozzle 603K dedicated to Flexjet 44332002 44332002 Pc Bd Ifdr Ctlr 2 Assy 4433580-1 44335801 Feeder Interface Board 44374702 EPC-5A Radisys EPC-5A 80486 CPU Board 45 VACUUM PUMP WASHER 45475008 45475008 Hard Drive Kit for Univers
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Make: Heller Model: 1809 EXL Vintage: 09-2007 Details: (9) Top & Bottom Heating Zones (2) Cooling Zones Windows 7 Operating System Edge Rail Conveyor & Center Board Support Air S
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , | Sales/Marketing
Sales Engineer/Manager/Representative in electronics and publication/newspaper industries
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_heller_1500s.html
Heller 1500s Heller Reflow Oven Equipment Description Heller Model Number: 1500s Serial Number: 119509C Left to Right PCB Flow 5 Heating Zones 1 Cooling Zone Edge Rail Conveyor Power 220 - 50/60HZ Location
Heller 公司 | https://hellerindustries.com.cn/power-electronics/
功率器件封装 – HELLER » 功率器件封装 功率器件封装 对无空洞的需求 当今功率电子的趋势是向更小的外形尺寸发展，同时保持或增加整体功率要求。 随着这些功率密度的增加，为了满足当今更严格的可靠性标准，适当的热管理变得越来越重要。 因此，现在必须使用无空洞的焊点和连接。 真空辅助回流焊仍然是实现无空洞焊接连接的优选方法之一，并广泛用于功率器件封装行业。 HELLER Industries公司拥有多种真空回流焊炉系统，其能力已被证明能够将焊料空洞减少到<1%。 heller提供多种真空回流焊
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
