Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Mon May 02 15:36:40 EDT 2011 | marcpeo
One more note on this. The techs tell me that the main reason for the PV immediately matching the Set Point is that the software is in "Edit Mode". This is a mode that allows one to iterate the software without the oven running. That might also ex
Electronics Forum | Fri Jun 18 13:57:30 EDT 2004 | Claude_Couture
I remember writing a piece of software in quickbasic to compare two of those files and count how many common parts there were in the two files. The process was automatic, I could feed it a list of all the files I wanted to check and it would compare
Used SMT Equipment | Soldering - Reflow
Make: Heller Model: 1809 EXL Features: OS: WIndows XP Software: 4.01.8 Left to Right Auto Lube Mesh Belt Dual Edge Rail Reflow Oven Location: Camarillo, CA USA
Used SMT Equipment | Soldering - Reflow
Make: Heller Model: 1809 EXL Vintage: 09-2007 Details: (9) Top & Bottom Heating Zones (2) Cooling Zones Windows 7 Operating System Edge Rail Conveyor & Center Board Support Air S
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Assembly Accessories
Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS w/3.0 min GPA, 0-2+ years experience using rational rose or similar OO case enviornment UML or comparable rotation scheme, Win NT, Networking communications, embedded systems; Must also know object oriented analysis, design
Career Center | Fremont, California USA | Engineering
Ensure manufacturing have calibration and preventive maintenance processes in place to ensure the integrity of test equipment used on our products. Lead and responsible for all aspects of the RMA/GRS processes from initial analysis, board debug t
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
Heller 公司 | https://hellerindustries.com.cn/software
HELLER Industries-软件下载 » 用于PCB焊接的对流回流焊炉 » 软件下载 HELLER Industries-软件下载 请联系我们下载 HELLER软件产品 Heller 365 – Heller 365 是 SPC 和可追溯性软件包，提供 3 个级别： Level 1 – （可追溯性）包括所有产品运行的记录、烘箱参数、CpK Level 2 – （Profile监控）包括 1 级功能和每块板的profile监控。 Level 3 – （Profile监控）包括 1级功能以及使用放置在板级附近的附加传感器棒对每个电路板进行Profile监控。 Heller Interface和Heller支持赋能工业 4.0持 兼容的接口标准 IPC CFX Hermes SECS/GEM ASM iLNB Fuji Link
Lewis & Clark | http://www.lewis-clark.com/product-tag/heller-1707/
Heller 1707 Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
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