Industry Directory | Manufacturer
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Industry Directory | Distributor
Distributor for Bulgaria for Henkel Adhesive Electronic Materials.
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
Electronics Forum | Wed Aug 27 08:00:33 EDT 2008 | cgray
We are using Multicore (MFR 301) from Henkel.
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2013-03-12 11:34:11.0
GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2010-09-23 18:22:39.0
If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Printed Circuit Board Protection Methods - Conformal Coating Encapsulants Potting Module Sealing Low Pressure Molding
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Events Calendar | Wed Oct 20 00:00:00 EDT 2021 - Wed Oct 20 00:00:00 EDT 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Surface Mount Technology Association (SMTA) | https://www.smta.org/europe/
Board Selective Soldering a Big HIT at Henkel Lead-Free & Tin/lead Selective Soldering, Design, Quality Control & Practical Defect Solutions Tuesday 15 th October, Henkel, Hemel Hempstead
| https://www.eptac.com/faqs/ask-helena-leo/ask/component-encapsulation
://www.ellsworth.com/henkel-loctite/ http://www.stanleysupplyservices.com/search.aspx?q=adhesives There are all kinds of product on these sites which will meet the requirements you are looking for
