New SMT Equipment: hepco 7900 (1)

HEPCO DIP Lead Formers

HEPCO DIP Lead Formers

New Equipment | Lead Forming

Series 7900 Convertible DIP Lead Formers Automatically Adjusts for Body Thickness Variations. One Machine for .300", .400" and .600" DIPS Fast, Simple Conversion - Under 2 Minutes. Comes with Complete Conversion Kit Including Guides, Rollers and

HEPCO, Inc.

Used SMT Equipment: hepco 7900 (3)

Hepco 7900-LF

Used SMT Equipment | THT Equipment

DIP LEAD FORMER 7900-LF 115V 0.55A 60HZ FORMS DIP IC'S FOR THROUGH HOLE ASSEMBLY ON 0.30 / 0.40 & 0.60 inch LEAD CENTERS

Valley Printed Circuits

Hepco 7900-LF3 DIP Lead Former

Hepco 7900-LF3 DIP Lead Former

Used SMT Equipment | General Purpose Test & Measurement

Hepco 7900-LF3 DIP Lead FormerSN: 1703 General specs:Series 7900 Convertible DIP Lead FormersAutomatically Adjusts for Body Thickness Variations.One Machine for .300", .400" and .600" DIPS Fast, Simple Conversion - Under 2 Minutes.Fixed Tooling Means

Tekmart International Inc.

Express Newsletter: hepco 7900 (64)


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Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
Void Free Reflow Soldering

High Throughput Reflow Oven
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
design with ease with Win Source obselete parts and supplies

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