Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider
An internationally accredited, full service testing and analysis company providing design studies, failure analyses, product/material qualifications, safety inspections, and consulting services
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Mon Aug 23 20:21:00 EDT 2021 | jorgealvarado
does anyone know what equipment I can use to test high current EV batteries? We want to expand our testing capabilities and standardize all our battery testing. Looking for feedback from anyone who has used test equipment for electric vehicle batteri
Electronics Forum | Wed Aug 25 05:08:21 EDT 2021 | andyzen
I think this is what you are looking for, try https://testforum.net/what-is-battery-test/ Not sure if they have reviews or not but I see Keysight, ITECH, Chroma, and other brands might be worth asking them. Good luck!
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI SMT Machine JX-350 LED high speed SMT machine Technical parameters: P C B size：1 transfer650㎜×360㎜/Two moves1,200㎜×360㎜/3 moves 1,500㎜×360㎜ Component Height:6mm/12mm Component range:0603 (British 0201) ~ □33.5㎜ Component
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | Pick and Place/Feeders
GIC-F01 FUJI NXT Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Parts & Supplies | Pick and Place/Feeders
GIC-Y01 YAMAHA Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of de
Technical Library | 2011-11-25 16:07:47.0
The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue May 24 00:00:00 EDT 2022 - Tue May 24 00:00:00 EDT 2022 | Laurel, Maryland USA
SMTA Capital Chapter Expo - Advanced Manufacturing on Supply Chain Solutions
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Orlando, Florida USA | Production
Position Summary: Build through-hole (THT) and surface mount (SMT) printed circuit board assemblies, placing components on boards per controlled parts lists, drawing documentation and quality workmanship guidelines. Position reports to: Group Lea
Career Center | Munich, Germany | Engineering
Master electrical engineering degree specialized in: Electric circuits and systems Software knowledge: C, C#, C++ Python SystemC VHDL
Career Center | Manila, Philippines | Engineering
I am an experienced Electronics Engineer which is capable in electronics circuit design, trouble shooting and debugging. Have been involved in an R and D environment for 10 years which focus on the designing of power electronics circuit. Currently ho
New Methods of Testing PCB Traces Capacity and Fusing New Methods of Testing PCB Traces Capacity and Fusing by: Norocel Codreanu, Radu Bunea, Paul Svasta; "Politehnica" University of Bucharest, Center for Technological Electronics
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
High Temperature PCB: Considerations for High-Heat Applications Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/nordson-supports-high-school-fabrication-lab
Nordson Supports High School Fabrication Lab Nordson Corporation Global Directory | Languages NASDAQ $230.50 -0.49 Our Products Our Industries Our Applications Brands
