Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
Manufacture high-density memory and processor-based products, displays, interfaces
JUKI JX-300 LED SMT Chip Mounter Machine Improvements in Productivity Outstanding Area Productivity Mounting Quality that Supports High Density Mounting Model Interchangeability Model FX-3 FX-1R(Conventional model kind) P
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
Used SMT Equipment | SMT Equipment
Product name: YSM40 high density modular chip mounter Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and "flexibility" 100000 CPH (IPC9850) high-speed productivity There are three mount head types to ch
Used SMT Equipment | Pick and Place/Feeders
Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and"flexibility" 100000 CPH (IPC9850) high-speedproductivity There are three mount head types to choosefrom Only 1 m wide, small body Wi
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
HMH-830 PCBA coating machine PCBA coating system X, Y, Z, three-axis motion, accurately realize the selective spraying process of various circuit boads to avoid non-coated areas such as connectors. 1.Accurately realize selective spraying of various
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Mar 25 18:30:00 UTC 2024 - Mon Mar 25 18:30:00 UTC 2024 | Peoria,
Ultra High Density Interconnect Conference
Events Calendar | Mon Apr 20 18:30:00 UTC 2020 - Wed Apr 22 18:30:00 UTC 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Malibu, California USA | Management
Title: President / General Manager Location: Southern California Experience: P&L Technical degree Supervise: QA, Operations, engineering & marketing 10 years plus high-density electronic components Salary: $150K + Email resume to: tmyers@electronicc
Career Center | Marietta, Georgia USA | Engineering,Production
Currently seeking a senior pcb designer with Veribest cad experience. Knowledge of RF circuit design parameters, high density, multi-layer, and double sided. Analog/digital smd circuit board strongly desired. Designer will be responsible for pcb boar
Career Center | Mysore, India | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
Please refer my CV
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: SMT High Density
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/info-center/news/nordson-introduces-the-encore-hd-mobile-powder-spray-system-at-fabtech
Nordson Introduces the Encore® HD Mobile Powder Spray System at FABTECH; Proven High-Density, Low-Velocity Technology in a Powerful Mobile Unit Industrial Coating Systems Corporate | Global Directory
| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
