Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Thu Sep 30 11:23:41 EDT 1999 | Wolfgang Busko
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Used SMT Equipment | Pick and Place/Feeders
Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and"flexibility" 100000 CPH (IPC9850) high-speedproductivity There are three mount head types to choosefrom Only 1 m wide, small body Wi
Used SMT Equipment | SMT Equipment
Product name: YSM40 high density modular chip mounter Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and "flexibility" 100000 CPH (IPC9850) high-speed productivity There are three mount head types to ch
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Parts & Supplies | Pick and Place/Feeders
GIC-F01 FUJI NXT Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | Malibu, California USA | Management
Title: President / General Manager Location: Southern California Experience: P&L Technical degree Supervise: QA, Operations, engineering & marketing 10 years plus high-density electronic components Salary: $150K + Email resume to: tmyers@electronicc
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, March 1, 2018, Subscribers: 31,280, Companies: 10,908, Users: 24,452 Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma, Jeffrey Kennedy, Thilo Sack; Celestica Corporation Circuit functional density
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: SMT High Density
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/screen-changers/large-area-filters-poly
Backflush Screen Changers V-Type 3G Double Piston Backflush Screen Changer R-Type Recycling Filter POLY Continuous Large Area Filters High Capacity Slide Plate Screen Changers SPC Breaker Plates FlexDisc™
Baja Bid | https://bajabid.com/product-tag/hybrid-double-density/
Hybrid Double Density Archives - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
