Industry Directory: high heat dissipating (71)

Japan Unix Co., Ltd.

Industry Directory | Consultant / Service Provider / Manufacturer

Manufacturer of robotic soldering equipment including contact, laser and ultrasonic soldering available in several robotic platforms including desktop, SCARA, cartesian and six axis multi-articulated robots.

SinkPAD Corporation

Industry Directory | Manufacturer

An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.

New SMT Equipment: high heat dissipating (634)

High Volume Reflow Oven - 1936/2043 Mark5

High Volume Reflow Oven - 1936/2043 Mark5

New Equipment | Reflow

The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &

Heller Industries Inc.

SMT Reflow Oven - 1826 Mark 5

SMT Reflow Oven - 1826 Mark 5

New Equipment | Reflow

The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!

Heller Industries Inc.

Electronics Forum: high heat dissipating (521)

Looking for Wave-Exit conveyor belt(ESD, heat dissipative, flux)

Electronics Forum | Tue Dec 16 16:14:20 EST 2003 | Bill

We are in need of a replacement conveyor belt for an unload-end conveyor(post wave solder). The part number we had at one point (formerly PCT automation) was 65-4008-4 (Belt, Flat-W=23.75 L=171.70) green high temp conveyor belt. Any help would be g

PCB copper to disipate heat

Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef

Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes

Used SMT Equipment: high heat dissipating (74)

Heller 1088EXL

Heller 1088EXL

Used SMT Equipment | Soldering - Reflow

Hello and thank you for your interest in our Heller 1088EXL Reflow Oven. See attached pictures and information Heller Reflow Oven Model Number: 1088EXL Serial Number: 0201DA1A1-53956 Year: Feb 2001 Left to Right Process Flow 8 heating zone for

1st Place Machinery Inc.

Heller REFLOW OVEN MK3 2013

Heller REFLOW OVEN MK3 2013

Used SMT Equipment | Soldering - Reflow

Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min

Qinyi Electronics Co.,Ltd

Industry News: high heat dissipating (1006)

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

Parts & Supplies: high heat dissipating (92)

Technical Library: high heat dissipating (39)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Thermal Interface Materials Drive Electronic Innovation

Technical Library | 2024-08-20 00:41:48.0

Thermal interface materials (TIMs) play a pivotal role in ensuring efficient thermal management by facilitating heat transfer between heat generating components and heat-dissipating devices

GPD Global

Videos: high heat dissipating (383)

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

GPD Global: Multi-Functional System Dispense with Pick and Place

GPD Global: Multi-Functional System Dispense with Pick and Place

Videos

http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo

GPD Global

Training Courses: high heat dissipating (3)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Rework of Leadless Devices Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: high heat dissipating (6)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference

Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA)

Career Center - Jobs: high heat dissipating (12)

Senior Design Engineer

Career Center | Murphy, North Carolina USA | Engineering

We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel

Aegis Power Systems, Inc.

Project Engineer

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development

EMSR, Inc.

Career Center - Resumes: high heat dissipating (3)

Quality Control/Production and Management

Career Center | Melbourne, Florida USA | Management,Production,Quality Control

Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude

Sr.SMT Engg / SMT Production Incharge

Career Center | Mumbai, India | Maintenance,Management,Production,Technical Support

SMT Manufacturing, MYDATA/ Mycronic Machine Experience, SMT Production Execution, SMT Machine Maintainance Planning & Execution

Express Newsletter: high heat dissipating (859)

SMTnet Express - May 15, 2014

SMTnet Express, May 15, 2014, Subscribers: 22742, Members: Companies: 13878, Users: 36194 Performance of Light Emitting Diode on Surface Machined Heat Sink S. Shanmugan, D. Mutharasu, O. Zeng Yin, Universiti Sains Malaysia In the point

Partner Websites: high heat dissipating (1709)

HEAT DAMAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1148-heat-damage

HEAT DAMAGE ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● D9650 ● D9650Z PRODUCTION ● FastLine P300 ● Facts2 DF2400

ASYMTEK Products | Nordson Electronics Solutions

High Precision Dispensers Heated

GPD Global | https://www.gpd-global.com/high-precision-dispensers-maxii.php

: heat capability in the work area an optional nozzle and/or material heat These high precision dispensers process heated applications such as

GPD Global


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