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H-ST is an ISO 9001 compliant, custom high reliability electronic contract manufacturer specializing in turnkey services for box builds, PCBAs, cables and harnesses.
The analysis of friction and wear properties of materials at elevated temperatures has become increasingly important, especially for the development and quality control of combustion engine and power plant constituent parts. To meet the resulting nee
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Industry News | 2020-12-23 19:09:09.0
Sumida Surface Mount Automotive Power Inductors Handle High Temperatures, High Currents
Industry News | 2005-04-26 15:48:02.0
New family of high-threshold, low on-resistance power MOSFETs for automotive and other high-current, high-temperature applications was issued by Siliconix.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Article Return to Front Page A Low Temperature Alte
Article Return to Front Page A Low Temperature Alte
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
(virtually free of vapor inclusions that are commonly found in adhesives produced by the traditional solvent coating technique). Excellent high temperature performance as well as excellent shear strength
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
