Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Industry Directory | Manufacturer
A manufacturer of pressure-sensitive adhesive tapes and films.
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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
The heat resistance and dielectric strength of polyimide tapes make them an excellent choice for high temperature masking and electrical insulation. CGS has different thickness polyimide coated with silicone. CGS can offer different width such as
Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Electronics Forum | Thu Sep 23 06:06:20 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Used SMT Equipment | Pick and Place/Feeders
JUKI RX-6R Compact Modular SMT Mounter Placement speed Chip : 52,000CPH*2IC : 14,000CPH*3 Component size 0402mm(01005 inch) ~ 50mm×50mm*40402mm(01005 inch) ~ 100mm×100mm / 50×180mm*5 Board size Single lane conveyor:50×50 ~ 610×590 / 905×590(
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Parts & Supplies | Assembly Accessories
Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is
Parts & Supplies | Assembly Accessories
Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
) 4.2 mils Tape 7952MP Clear (0.06 mm) “3M 200MP” 50 grams/inch 2) Tan, 58# PCK 2) 4.2 mils 12 grams/inch Constructions 3 High Performance Adhesive Transfer Tapes with Adhesive 200MP 467MP • 468MP • 467MPF • 468MPF • 467MPR • 468MPR • 7952MP • 7955MP 7962MP • 7965MP • 9172MP • 9172PT • 9185MP • 9188 • 9667MP • 9668MP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/tape-and-label?page=2
Tape & Label Production Equipment | Nordson Nordson Corporation Global Directory | Languages NASDAQ $202.46 +1.64 Our Products Our Industries Our Applications Brands
