Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Standard Printed Circuit Boards custom manufactured over 1,000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the Telecom/IT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250° Ce
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to PCB preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports odd-shaped PCB through conveyor * Accurately loc
Electronics Forum | Thu Sep 23 06:01:16 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Electronics Forum | Thu Sep 23 06:06:20 EDT 1999 | joel cruz
| | I'm looking for some good articles on reflowing of double sided SMT boards. I'd like to come up with a process for low volume prototyping, but need to understand the do's and don'ts. | | | Hello, | you can get some insight by typing in double s
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
JUKI HA005530010 SWITCH(BEZEL) www.fujintai.com JUKI HA005530020 SWITCH(LENS WHITE) FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00553002A SWITCH www.fujintai.com JUKI HA00553002B SWITCH FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00553002C SWITCH www.fujintai.
Parts & Supplies | Pick and Place/Feeders
JUKI HA004360000 SWITCH www.fujintai.com JUKI HA004470000 PROTECTOR 5A FUJINTAI TECHNOLOGY CO.,LTD JUKI HA004540000 SWITCH www.fujintai.com JUKI HA004540020 SWITCH OPERATION FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00454002A SWITCH OPERATION www.fu
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
link: https://www.ascen.ltd/Products/conformal_coating_equipment/ ASCEN designs and manufacturers pcb conformal coating machine for the printed circuit board industry.surface conformal coating equipment include selective coating,brush coating, aeroso
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
High-efficiency high end reflow oven , SMT reflow oven , reflow soldering machine , for SMT assembly line. In the contemporary era of the development of electronic products, in order to pursue the smallest possible size and intensive assembly of plug-ins, double-sided PCBs have become quite popular, and
Imagineering, Inc. | https://www.pcbnet.com/blog/types-of-pcb-their-advantages/
. These boards are often found in cameras, calculators, and radio devices. They can also be found in simple toy design. Double-Sided The double-sided PCB works in a manner very similar to the single, but both sides are sandwiched between the conductive layer
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