Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Tue Jun 10 09:46:28 EDT 2008 | dyoungquist
We run a high mix/low-medium volume smt line with MPM SPM stencil printer, MyData pick-n-place machine and a Heller reflow oven. That combination is working well for us.
Electronics Forum | Mon Jun 09 16:55:11 EDT 2008 | sys_steven
What is everyone's top 5 equipment lines for high mix, with flexiblity to do multiple volumes.
Used SMT Equipment | SPI / Solder Paste Inspection
The inspection speed is much faster to meet requirements of high speed of production lines. CKD pursuits the high speed operation and achieves the fastest speed, 8000mm2/sec., in the SMT market. (25um Standard Machine Inspection) It supports the prod
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,
Ultra High Density Interconnect Conference
Career Center | , Tennessee USA | Management
We are searching for an experienced process engineering manager to join our organization!! We need an individual knowledgeable of high speed high volume manufacturing process. Ideal individuals -Will possess a BSEE or BSEET -3 plus years of managem
Career Center | Huntsville, Alabama USA | Accounting/Finance,Clerical,Purchasing
Administer the company's Export Compliance Program for a high volume, worldwide electronics products manufacturer. Requires several years experience with administration of a corporate export compliance program, preferably in the electronics manufactu
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 70, (#ts#)) SMT Express, Volume 3, Issue No. 9 - from SMTnet.com Volume 3, Issue No. 9 Tuesday, September 18, 2001 Featured
Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments SMTnet Express November 28, 2012, Subscribers: 26024, Members: Companies: 9054, Users: 34001 Overcoming
Heller Industries Inc. | https://hellerindustries.com/1913mk7-2/
High Volume Reflow Oven -1913 Home » 1913MK7 1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
VIA High Volume Series | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
