Industry Directory | Manufacturer
Manufacture high-density memory and processor-based products, displays, interfaces
Industry Directory | Association / Non-Profit
HDP User Group is a non-profit trade organization that offers memberships to companies involved in the supply chain of manufacturing products that utilize high-density electronic packages.
New Equipment | Rework & Repair Services
ScanCAD provides comprehensive electronics reverse engineering services, transforming physical printed circuit boards (PCBs), ceramic substrates, and hybrids into complete manufacturing data packages. Utilizing advanced, high-resolution scanning syst
New Equipment | Coating Equipment
ASCEN Conformal coating spray equipment provide a is a high-performance film as a protective layer for PCB from the environment, enabling the board to withstand more moisture thereby increasing its surface resistance. It is because of this
 HAKKO Rework.jpg)
Used SMT Equipment | Repair/Rework
HAKKO FR-1418 BGA Rework Station Vintage: 2015 (Refurbished 2016) Fully Functional & Tested Power: 208V Single Zone High Density Preheat 1500W (12" x 10") Automatic-Z w/ PC Control 2kW Top Heater Pan and Tilt Mirror Two 500W IR
Used SMT Equipment | Pick and Place/Feeders
Specification： HS-520 Series is a new generation radial insertion machine researched and developed independently by Hexi , now is being widely used. Chinese& English operation interface(Windows control) with LCD, make it easy for user to learn, re
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
link: https://www.ascen.ltd/Products/conformal_coating_equipment/ ASCEN designs and manufacturers pcb conformal coating machine for the printed circuit board industry.surface conformal coating equipment include selective coating,brush coating, aeroso
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Jun 01 18:30:00 UTC 2020 - Wed Jun 03 18:30:00 UTC 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Events Calendar | Mon Apr 20 18:30:00 UTC 2020 - Wed Apr 22 18:30:00 UTC 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Career Center | Huntington Beach, California USA | Management,Sales/Marketing
I am seeking a position in Sales and Marketing. I have proven track record of closing large deals with over 21+ years experience in the High Technology, Computer Electronics industries working in both sales and marketing management positions with
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: SMT High Density
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/industries/packaging?con=t
equipment plays role in circular economy by pelletizing high-quality polyamide made from multi-layer packaging waste in Newcycling® process Polymer Processing Systems Nordson’s BKG®
Baja Bid | https://bajabid.com/product-tag/hybrid-double-density/
Hybrid Double Density Archives - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
