SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron
The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | Soldering - Reflow
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
Industry News | 2017-02-02 10:26:34.0
Nordson ASYMTEK, a Nordson company will exhibit its latest and most popular technologies for fluid dispensing, jetting, conformal coating, and hot bar soldering in booth 1611 at the IPC APEX tradeshow, in San Diego, California, being held February 14-16, 2017. ASYMTEK is joining its sister Nordson companies to support IPC as it celebrates its 60th year in the electronics manufacturing industry.
Industry News | 2020-01-23 17:30:46.0
ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Effect Of Board Clamping System On Solder Paste Print Quality Effect Of Board Clamping System On Solder Paste Print Quality Stencil printing technology has come a long way since the early 80s when SMT process gained importance in the electronics
GPD Global | https://www.gpd-global.com/pdf/doc/Advanced-FPC-Real-Time-Controller-User-Guide-22940009.pdf
combinations. Optimization RECOMMENDATION: Start with an initial air pressure setting of 5.51 bar (80 psi) and, as needed, adjust for optimal operations for your process. CAUTION: Do not connect all optional items available into the controller at the same time
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder_vitronics.html
) Heat-up Time of Solder Bath: Approx. 2.5 hours to reach 250 degrees c (482 degrees F) for eutectic 63/37 solder, by 3 heating elements (1 kW each
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