We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
Benchtop Convection SMT Reflow Oven T200C Product Description Honor customer : TORCH brand desktop reflow oven has got purchse order from TOP 500 enterprises: GE, CISCO, 3M, TI, NVIDIA, Nortel Network ect last year, especially GE and CISCO, totall
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 xbox one controller motherboard repair machine price WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main use
Electronics Forum | Thu Sep 03 11:18:04 EDT 2009 | dyoungquist
We do not have any electrolytic capacitors on this board.
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2018-10-18 10:20:21.0
How to get real-time thermal data for a PCB?
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
Productronica 2007 Special Show Report Productronica 2007 Special Show Report Attending Productronica 2007 was a first for the staff of SMTnet. It was a surprising and impressive event. BIG!.. EXTRAVAGENT!.. LAVISH
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
pixels in order to have a fair measurement. Once a ball diameter has been defined, the system can automatically determine the level of voiding within each defined BGA ball. A second gray level threshold is applied against which all pixels within each
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
