Blackfox Training Institute, LLC | https://www.blackfox.com/3-rising-pcb-assembly-trends-in-2021/
. That’s where High-Density Interconnect (HDI) comes in. HDI PCBs will enable boards to have more wiring in one area. This is the key to keeping up with the rise of IoT
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23577.chtml
. Key Advances in Void Reduction with Vacuum Technology One of the challenges facing the industry is the requirement to significantly reduce voids from the process
