Electronics Forum | Thu Jan 14 09:03:21 EST 2010 | cbart
I really don't have one, however our customers do. Since they see a spec in IPC for BGA's they have either addopted the 25% from the BGA spec or come up with their own. Also many have heard that IPC is working on defining critera. I was hoping othe
Effect Of Squeegee Blade On Solder Paste Print Quality Effect Of Squeegee Blade On Solder Paste Print Quality The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
conditions are shown in Table 4. This table also indicates the impact of the voids on the characteristic life calculated for each data set. Processed Data 0% 20% 40% 60% 80% 100% 0 250 500 750 1000 1250 1500 Cycles C u m u la ti ve F ai lu re BGA 56 / typical
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Solder Joint Void Classifications [3] Figure 2a. Locations within a BGA solder joint where voids are expected to have a greater risk on joint reliability [3]. mailto:richard.coyle@nokia-bell-labs.com mailto:david.hillman
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