New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Electronics Forum | Tue Aug 31 19:17:43 EDT 2004 | russ
Now see Dave, now I have some good info on why it is "bad", This must be the lead enrichment I have heard about but never got any substantiated data or explanantion. I wonder how much weaker or less reliable these are. Is there any data that you k
Electronics Forum | Mon Jan 11 13:31:54 EST 2010 | cbart
I know IPC is working on a spec for voiding for QFN'S. However since its not released I'm curious what others have defined as the max allowable % voiding on the leads (not center ground).
Industry News | 2013-08-27 13:14:25.0
Baja Bid, a leading host for online SMT exchange auction events, is kicking off another sale of used SMT, assembly, and remanufactured SMT equipment.
Industry News | 2013-08-22 12:55:43.0
A leading auction agency has announced it will be hosting an online exchange auction of used equipment utilized in the electronics manufacturing industry. The auction opens on Tuesday, August 27, 2013 at 8:00am EST and begins closing on Thursday, August 29, 2013 at 11:00am EST.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
and which are tin lead BEST, INC While experienced inspe
| https://www.eptac.com/blog/how-to-safeguard-against-counterfeit-components
How to Safeguard Against Counterfeit Components Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-to-lead-free-or-not-to-lead-free-that-is-the-question/
. Lead free flux is more irritating to the eyes and respiratory tract than leaded flux. In addition, leaded flux protects against tin whiskers, which can grow quickly and in large amounts, which can lead to failures in functioning
