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Electronics Forum | Tue Sep 27 15:58:01 EDT 2011 | ck_the_flip
We use exclusively pneumatic feeders and can NOT control the force or speed of advancement. We get a lot of components (mostly LED-type packages) that tend to flop around in the pocket a lot and are flipped on the side or “thrown” by the feeder duri
Electronics Forum | Wed Jun 18 07:49:06 EDT 2008 | more_sunshine
hi i'm not experienced in creating pcbs but i have good background, and i have a bunch of questions. i have no access to world wide known pcb chemicals but i managed to get a cramolin positiv spray and i don't know if it is still usable or not? (di
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
. Transport Wheel Maintenance Instructions for installing rubber pads on transport wheel shims, plus how to replace the shims themselves - both the standard type and the rubber-padded type
| https://www.smtfactory.com/How-Does-I-C-T-Support-Our-Customer-to-Set-Up-LED-Factory-id48948727.html
How Does I.C.T Support Our Customer to Set Up LED Factory - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
