The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc
Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2020-01-23 17:30:46.0
ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Eliminate Body Stress with Versatile CF-8 Lead Former GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exactin
decade, depositing adhesives for SMT components on th
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-User-Guide-801-1-07.pdf
/91 Specifications2-9 Figure 9 Vertical Component Elements 2.2.4 Processing Ranges (continued) In the figure and chart below: B = Body to Bend H = Height of Leg C = Crimp Height R = Bend Radius Vertical Components Inches Metric (mm) Dimension Minimum
| https://www.eptac.com/blog/how-to-achieve-reliable-electronic-assemblies-for-space-travel
How to Achieve Reliable Electronic Assemblies for Space Travel: J-STD-001 and Beyond Looking for solder training standards, manuals, kits, and more
