New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Assembly Services
TI New and Original LMZ31710RVQ in Stock IC QFN42, 2021+ package LMZ31710RVQ 2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338N-B-GM QFN TI 21+
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
TI New and Original LMZ31710RVQ in Stock IC QFN42, 2021+ package LMZ31710RVQ 2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338N-B-GM QFN TI 21+
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. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
