Industry News | 2025-07-07 12:56:47.0
The Murray Percival Company, a trusted supplier to the Midwest's electronics industry, is pleased to announce that it has added CeTaQ to its line card, a global expert in Surface Mount Technology (SMT) measurement systems. This strategic addition strengthens Murray Percival's commitment to delivering process optimization solutions to electronics manufacturers across the region.
Industry News | 2015-08-26 18:50:06.0
ASC International today announced that will exhibit in Booth #518 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. ASC will exhibit the VisionPro M500, VisionPro AP500 and the LineMaster DM with the latest larger FOV - PSI 1000 sensor. The new PSI sensor provides inspection speed improvements of 5X over previous PSI sensors. The combination of 2D AOI along with the newly added higher speed SPI elevates the LineMaster to an integrated inspection platform all on its own.
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
– Void Rate 9.8% Fig 22: Pressure: Leg 33 – Void Rate 13.2% Fig. 23: Pressure: Non-optimized High Pressure Reflow Result - Void Rate 36.4% This investigation into how various process parameters effect the void rates for TIM1 lid attach has led to several
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
- The importance of controlling moisture levels during BGA reflow, as seen by BGA X-ray inspection. PCB Through Hole Component Quality Soldering Process Improvement of Critical SMT Connectors - Using X-ray inspection and mechanical pull testing to optimize wave soldering process parameters for high density connectors
